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  april 2006 rev 2 1/11 STTH3002C high efficiency ultrafast diode main product characteristics features and benefits suited for smps low losses low forward and reverse recovery times high surge current capability high junction temperature insulated version top3i: ? insulated voltage: 2500 v rms ? capacitance 12 pf description dual center tab rectifier suited for switch mode power supplies and high frequency dc to dc converters. packaged in to-220ab, to-247, i2pak, d2pak, and top3i, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection order codes i f(av) 2 x 15a v rrm 200 v t j (max) 175 c v f (typ) 0.75 v t rr (typ) 17 ns part number marking STTH3002Ct STTH3002C STTH3002Cw STTH3002C STTH3002Cr STTH3002C STTH3002Cg STTH3002C STTH3002Cg-tr STTH3002C STTH3002Cpi STTH3002C d 2 pa k STTH3002Cg k a1 a1 nc a1 a1 a1 k k k k a2 a2 a2 a2 a2 to-220ab STTH3002Ct to-247 STTH3002Cw top3i STTH3002Cpi i 2 pa k STTH3002Cr a1 k a2 www.st.com
characteristics STTH3002C 2/11 1 characteristics when the two diodes 1 and 2 are used simultaneously: ? tj(diode 1) = p (diode 1) x r th(j-c) (per diode) + p (diode 2) x r th(c) table 1. absolute ratings (limiting values at t j = 25 c, unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 200 v i f(rms) rms forward current 50 a i f(av) average forward current, = 0.5 to-220ab, to-247, i 2 pak, d 2 pa k per diode t c = 150 c 15 a per device t c = 145 c 30 top3i per diode t c = 125 c 15 per device t c = 105 c 30 i fsm surge non repetitive forward current t p = 10 ms sinusoidal 180 a t stg storage temperature range -65 to +175 c t j maximum operating junction temperature 175 c table 2. thermal parameters symbol parameter value unit r th(j-c) junction to case to-220ab, to-247, i 2 pa k , d 2 pa k per diode 1.5 c/w total 1.0 top3i per diode 3.5 total 2.3 r th(c) coupling to-220ab, to-247, i 2 pa k , d 2 pa k 0 . 5 top3i 1.1
STTH3002C characteristics 3/11 to evaluate the conduction losses use the following equation: p = 0.69 x i f(av) + 0.01 i f 2 (rms) table 3. static electrical characteristics symbol parameter test conditions min. typ max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 20 a t j = 125 c 10 125 v f (2) forward voltage drop t j = 25 c i f = 15 a 1.05 v i f = 30 a 1.18 t j = 150 c i f = 15 a 0.75 0.84 i f = 30 a 0.99 1. pulse test: t p = 5 ms, < 2 % 2. pulse test: t p = 380 s, < 2 % table 4. dynamic characteristics symbol parameter test conditions min. typ max. unit t rr reverse recovery time i f = 1 a, di f /dt = 200 a/s, v r = 30 v, t j = 25 c 17 22 ns i rm reverse recovery current i f = 15 a, di f /dt = 200 a/s, v r = 160 v, t j = 125 c 67.8 a t fr forward recovery time i f = 15 a, di f /dt = 200 a/s v fr = 1.1 x v fmax , t j = 25 c 110 ns v fp forward recovery voltage i f = 15 a, di f /dt = 200 a/s, t j = 25 c 2.5 v figure 1. peak current versus duty cycle (per diode) figure 2. forward voltage drop versus forward current (typical values, per diode) 0 20 40 60 80 100 120 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 i(a) m t =tp/t tp i m p = 30w p = 15w p = 10w 0 10 20 30 40 50 60 70 80 90 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 v(v) fm i(a) fm t =25c j t =150c j
characteristics STTH3002C 4/11 figure 3. forward voltage drop versus forward current (maximum values, per diode) figure 4. relative variation of thermal impedance junction to case versus pulse duration 0 10 20 30 40 50 60 70 80 90 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 i(a) fm v(v) fm t =25c j t =150c j 0.1 1.0 1.e-03 1.e-02 1.e-01 1.e+00 z/r th(j-c) th(j-c) single pulse t(s) p figure 5. junction capacitance versus reverse applied voltage (typical values, per diode) figure 6. reverse recovery charges versus di f /dt (typical values, per diode) 10 100 1000 0 50 100 150 200 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j 0 25 50 75 100 125 150 175 200 225 250 10 100 1000 q (nc) rr di /dt(a/s) f i =15a f v =160v r t =125c j t =25c j figure 7. reverse recovery time versus di f /dt (typical values, per diode) figure 8. peak reverse recovery current versus di f /dt (typical values, per diode) 0 10 20 30 40 50 60 70 10 100 1000 t (ns) rr di /dt(a/s) f t =25c j t =125c j i =15a f v =160v r 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 10 100 1000 i (a) rm di /dt(a/s) f t =25c j t =125c j i =15a f v =160v r
STTH3002C ordering information scheme 5/11 2 ordering information scheme figure 9. dynamic parameters versus junction temperature figure 10. thermal resistance junction to ambient versus copper surface under each tab (epoxy printed circuit board fr4, e cu = 35 m) for d 2 pak 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 25 50 75 100 125 150 i rm q rr t (c) j qrr;i [t ]/qrr;i [t =125c] rm j rm j i =15a f v =160v r 0 10 20 30 40 50 60 70 80 0 2 4 6 8 10 12 14 16 18 20 s (cm2) cu r ( c/w) th(j-a) stth 30 02 cxx ultrafast switching diode average forward current 30 = 30 a 02 = 200 v ct = to-220ab cw = to-247 cg = d pak cr = i 2 2 pa k cpi = top3i repetitive peak reverse voltage package
package information STTH3002C 6/11 3 package information epoxy meets ul94, v0 cooling method: by conduction (c) recommended torque value: 0.8 nm maximum torque value: 1.0 nm table 5. to-220ab dimensions ref. dimensions millimeters inches min. typ max. min. typ max. a 15.20 15.90 0.598 0.625 a1 3.75 0.147 a2 13.00 14.00 0.511 0.551 b 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 c 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 2.40 2.70 0.094 0.106 f 6.20 6.60 0.244 0.259 ?i 3.75 3.85 0.147 0.151 i4 15.80 16.40 16.80 0.622 0.646 0.661 l 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 l3 1.14 1.70 0.044 0.066 m 2.60 0.102 c b2 c2 f ? i l a a1 a2 b e b1 i4 l3 l2 c1 m
STTH3002C package information 7/11 table 6. to-247 dimensions ref. dimensions millimeters inches min. typ max. min. typ max. a 4.85 5.15 0.191 0.203 d 2.20 2.60 0.086 0.102 e 0.40 0.80 0.015 0.031 f 1.00 1.40 0.039 0.055 f1 3.00 0.118 f2 2.00 0.078 f3 2.00 2.40 0.078 0.094 f4 3.00 3.40 0.118 0.133 g 10.90 0.429 h 15.45 15.75 0.608 0.620 l 19.85 20.15 0.781 0.793 l1 3.70 4.30 0.145 0.169 l2 18.50 0.728 l3 14.20 14.80 0.559 0.582 l4 34.60 1.362 l5 5.50 0.216 m 2.00 3.00 0.078 0.118 v5 5 v2 60 60 dia. 3.55 3.65 0.139 0.143 c b2 c2 f ? i l a a1 a2 b e b1 i4 l3 l2 c1 m
package information STTH3002C 8/11 table 7. i 2 pak dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 d 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 e 10 10.40 0.394 0.409 l 13 14 0.512 0.551 l1 3.50 3.93 0.138 0.155 l2 1.27 1.40 0.050 0.055 table 8. top3i dimensions ref dimensions millimeters inches min. max. min. max. a 4.4 4.6 0.173 0.181 b 1.45 1.55 0.057 0.061 c 14.35 15.60 0.565 0.614 d 0.5 0.7 0.020 0.028 e 2.7 2.9 0.106 0.114 f 15.8 16.5 0.622 0.650 g 20.4 21.1 0.815 0.831 h 15.1 15.5 0.594 0.610 j 5.4 5.65 0.213 0.222 k 3.4 3.65 0.134 0.144 ?l 4.08 4.17 0.161 0.164 p 1.20 1.40 0.047 0.055 r 4.60 typ. 0.181 typ. c b2 c2 f ? i l a a1 a2 b e b1 i4 l3 l2 c1 m r h k g f e d b a c jj p ?l
STTH3002C package information 9/11 figure 11. d 2 pak footprint (dimensions in mm) in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com. table 9. d 2 pak dimensions ref. dimensions millimeters inches min. max min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 g l l3 l2 b b2 e 2mm min. flat zone a c2 d r a2 v2 c a1 16.90 10.30 8.90 3.70 5.08 1.30
ordering information STTH3002C 10/11 4 ordering information 5 revision history part number marking package weight base qty delivery mode STTH3002Ct STTH3002C to-220ab 2.23 g 50 tube STTH3002Cw STTH3002C to-247 4.46 g 30 tube STTH3002Cr STTH3002C i 2 pak 1.49 g 50 tube STTH3002Cg STTH3002C d 2 pak 1.48 g 50 tube STTH3002Cg-tr STTH3002C d 2 pak 1.48 g 1000 tape and reel STTH3002Cpi STTH3002C top3i 4.7 g 30 tube date revision description of changes feb-2004 1 first issue 05-apr-2006 2 reformatted to current template. package top3i added.
STTH3002C 11/11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorize representative of st, st products are not designed, authorized or warranted for use in military, air craft, space, life saving, or life sustaining applications, nor in products or systems, where failure or malfunction may result in personal injury, death, or severe property or environmental damage. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2006 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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